The input cost of buying PCB laser cutting machine and plate splitting equipment is high, and the purchase process also needs to be more rigorous. Compared with other PCB splitting equipment, the technical threshold of PCB laser cutting machine is higher, and there are more technical data to be referred. As a customer, these strange materials seem strange and difficult to understand. How to understand PCB laser cutting and splitting equipment, chuangxuan laser brings you reference through this explanation.

As a manufacturer, our first choice is to understand the customer's requirements and recommend relevant models according to the requirements, such as whether the PCB material is aluminum substrate, epoxy resin, FR4, glass fiber board or paper substrate; The size of PCB products, whether there are V-grooves, and the thickness of products are all very important reference conditions.

1. Materials

According to the corresponding equipment recommended by the materials, QCW optical fiber laser cutting machine is generally selected for aluminum substrate and copper substrate. CO2 laser cutting machine is also used for plate splitting in the early days. With the progress of technology, it is gradually replaced. Green light or ultraviolet PCB laser cutting machine is selected for other materials.

2. Product processing speed and processing effect

The PCB laser cutting machine can meet the requirements of smooth section without burr, no stress and no deformation of the board, and can divide the PCB with components. However, the processing speed will have an impact on the processing effect. The recommended equipment here are UV PCB laser cutting and splitting machine and green PCB laser cutting and splitting machine.

When using ultraviolet laser equipment, the processing effect is better, but the efficiency is lower. When using green laser equipment, the processing effect is not as good as ultraviolet, but the efficiency is higher. At the same time, the thicker the plate material is, the lower the processing efficiency is, and the processing effect is relatively poor. Of course, this has a lot to do with the speed. Even a 2mm plate can be completely black without considering the speed. In terms of processing speed, the better the light absorption of the material, the faster the processing speed. For example, the paper substrate with the same thickness is faster than the epoxy resin material. The higher the power of the laser, the higher the single pulse energy and repetition rate, and the faster the cutting speed.

3. Processing width and processing gap

The processing method of PCB laser cutting machine is to scan back and forth through galvanometer, so there are two references: the processing format of galvanometer and the processing format of workbench. The processing format of galvanometer refers to the working area of single processing, and the effective format of workbench is the effective parameter for PCB size. In addition to the aluminum substrate and the copper substrate, the processing gap can be controlled within 100 microns by general material laser plate splitting machines, and 50 microns for thinner plates. The thinner the plate, the smaller the processing gap.

4. Carbonization

Carbonization is actually an embodiment of the processing effect. Carbonization does not exist on the cutting surface, but on the cutting section. On the one hand, carbonization is caused by the heat effect during the gasification process of high-energy beams, and on the other hand, the smoke generated during the gasification process is attached to the cross section.

How to effectively avoid this problem, on the one hand, is to improve the processing frequency of the laser, the pulse energy and the average power in the processing process. On the other hand, the carbonization is reduced by reducing the cutting speed, and some auxiliary dust extraction devices are added. Of course, customers with high requirements want to be completely black, which can be achieved, but it is very inefficient and difficult to be compatible.

The above points are the key factors of PCB laser cutting machine and plate splitting machine manufacturers for customer problems. From the customer's point of view, we need to understand the advantages and disadvantages of laser, and find a balanced solution according to the needs before we can choose the laser processing equipment we want.