As a kind of high-precision cutting equipment, picosecond laser cutting machine can be used for cutting thin metal and non-metal materials, and the precision can reach micron level. It is suitable for industries with high cutting requirements such as aerospace, automobile manufacturing, medical treatment, and consumer electronics. With good cutting effect, high efficiency and high precision, it is favored by all walks of life. The editor will talk to you today about the specific application scope of picosecond UV laser cutting.


1. Picosecond laser cutting film materials


Film materials are widely used in all walks of life, and can be divided into PET film, PI film, PP film and other transparent materials such as plastic films and composite films. Picosecond UV laser cutting machine can be used for fine cutting and cutting of film materials. Hole etching, etc., can also cut composite thin film materials, such as: cutting, etching, resistance adjustment, etc. of composite thin film materials such as copper, copper, aluminum, ITO, silver paste, FTO, etc.; realizing full-cut and half-cut of the cover film, etc.


2. Picosecond laser cutting silicon wafers, ceramic materials


Ceramic materials often exist as substrates in the electronics industry, and they have high requirements for cutting. Picosecond laser cutting machines can easily complete the cutting and punching of ceramic substrates such as alumina and zirconia, and have remarkable aesthetics and precision. The advantages.


3. Picosecond laser cutting circuit board


Circuit boards are the most widely used materials in the electronics industry, and cutting accuracy and cutting efficiency are often required to be high. Board cutting, fine cutting of FR4, reinforced steel sheet, FPC, flexible and rigid board, glass fiber board, etc.


4. Picosecond laser cutting thin metal material glass material


Thin metal refers to metal materials not exceeding 0.2 mm, such as copper foil, aluminum foil, stainless steel, alloy materials, etc. The glass material is mainly 3C thin glass, all of which are processed by picosecond UV laser cutting machine, with no burr, low carbonization, no deformation, small edge chipping, and precise cutting, which is used in military components, photovoltaic copper foil and other industries.