Laser marking machines are widely used in contemporary industrial production. From wood and paper marking to metal, the marking of high-end products in the production and processing process can not be separated from laser marking machines. With the improvement of market demand and the adaptation to various types of raw materials, the laser marking machine is constantly updated. The laser marking machine in China has also experienced a rapid development from pure foreign introduction in the early 20th century to independent research, development and production today.

Laser marking machine is commonly called as laser engraving machine, laser marking machine, laser marking machine, laser engraving machine, etc. But its professional name is laser marking machine. Laser marking machine can be divided into semiconductor laser marking machine, YAG laser marking machine, CO2 laser marking machine and fiber laser marking machine according to different lasers.

The laser marking machine was introduced from abroad at the end of the 20th century. The first laser marking machines were YAG laser marking machine and CO2 laser marking machine. Later, the invention of semiconductor laser followed by the semiconductor laser marking machine. With the continuous innovation of technology, the fiber laser was also invented. After the invention of the fiber laser marking machine, it quickly became the mainstream model with its advantages in all aspects. With the market demand for water-cooled CO2 laser marking machine, which is too large to meet the market demand, the RF air-cooled CO2 RF laser marking machine has been produced.

Two Laser Marking Methods

"Hot processing" refers to the laser beam with high energy density (it is a concentrated energy flow), which irradiates on the surface of the material to be processed. The material surface absorbs the laser energy and generates a thermal excitation process in the irradiation area, so as to raise the temperature of the material surface (or coating) and produce phenomena such as transformation, melting, ablation, evaporation, etc.

"Cold working" (ultraviolet) photons with high load energy can break the chemical bonds in materials (especially organic materials) or surrounding media, so as to cause non thermal process damage to materials. This kind of cold processing has special significance in laser marking processing, because it is not thermal ablation, but cold stripping that does not produce "thermal damage" side effects and breaks chemical bonds, so it does not produce heating or thermal deformation effects on the inner layer and nearby areas of the surface to be processed. For example, in the electronic industry, excimer lasers are used to deposit chemical films on the substrate, and narrow grooves are made on the semiconductor substrate.

Application of Laser Marking Machine in Products

CO2 laser marking machine: mainly used for non-metal (wood, acrylic, paper, leather, etc.).

Green laser marking machine, ultraviolet laser marking machine: mainly used for high-end extremely fine IC and other products. The price is high, and the products are mainly customized.

Lamp pump YAG laser marking machine: mainly used for metal, plastic and other low demand products, which has been eliminated at present.

Semiconductor side pump laser marking machine: It has the same application surface as the lamp pump YAG laser marking machine, but it is relatively stable. At present, the market is rare.

Semiconductor end pumped laser marking machine: It has the same application surface as the lamp pumped YAG laser marking machine, and is stable and power saving for high-end production.

Optical fiber laser marking machine: fine marking, power saving, maintenance free, used for high-end products such as mobile phones and buttons, is the mainstream model in the current market.